Considerable advancement has taken place in the design of newer and smaller surface mount devices which have necessitated changes in assembly and rework procedures and processes. These present many new challenges to rework personnel, technicians, engineers, and manufacturing managers.

SMT is still evolving at such a rapid pace that even veterans may need to update their skill and knowledge. Advanced SMT Assembly and Rework teaches the very latest assembly and rework techniques and instills the confidence and skills needed to deal with this changing technology.

This comprehensive, hands on training course, using state-of-the-art PACE SMT equipment, covers all aspects of advanced SMT assembly, rework and repair processes including BGA rework.

Course Objectives

1: The student will rework fine pitch and BGA components on SMT PCB’s observing safety precautions required to use the appropriate tools, solder and flux.

2: The student will rework fine pitch and BGA components on SMT PCB’s observing precautions required to eliminate ESD hazards.

3: The student will correctly identify, use, and maintain tools and accessories required to rework fine pitch and BGA components on SMT PCB’s.

4: The student will rework fine pitch and BGA components on SMT PCB’s demonstrating an understanding of solder, flux, heat transfer and the soldering process.

5: The student will prepare components and PCB’s for soldering.

6: The student will rework 0402 and 0201 size rectangular components.

7: The student will rework Micro Lead Frame (MLF) components.

8: The student will rework fine pitch Thin Small Outline Packages (TSOP) components.

9: The student will rework fine pitch Thin Quad Flat Pack (TQFP) components.

10: The student will rework SMCRAA components.

11: The student will rework Ball Grid Array (BGA & uBGA) components.

Call for information about having this class at your facility.