JSTD Document overview. 

IPC/EIA/JEDEC J-STD-001 Ansi approved lead free acceptance criteria.  World recognized as the sole industry consensus standard covering soldering materials and processes, includes criteria for lead free manufacturing, materials, methods and verification for producing quality soldered interconnections and assemblies. 

IPC "Certified IPC Specialist" 7.0 J-STD-001D with DS Requirements for Space Hardware Addendum This addendum is of specific interest to support the manufacturers whose products must survive the vibration and cyclic temperatures of going to or operating in space. Upon successful completion of this learning activity, students will be certified to the DS Module 6 of the IPC J-STD-001DS Space Hardware Addendum.  Participants will obtain the knowledge to Interpret the differences between the requirements of class 3 and the supplemental requirements for products going to or operating in space and Reference the J-STD-001D and Space Hardware standards to make accept/reject decisions.  This addendum can be taught with the original certification or as a separate class for existing CIS students.

IPC/EIA/JEDEC J-STD-002 Solderability tests for component leads terminations, lugs, terminals and wires.  Test method choices, defect definitions, acceptance criteria and illustrations for both the supplier and user 

IPC/EIA J-STD-003 Solderability for printed boards Industry recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated-through holes.  Test methods covered include edge dip, rotary dip, solder float, wave solder, and wetting balance 

IPC J-STD-004 Requirements for Soldering Fluxes. Covers requirements for qualification and classification of rosin, organic, and inorganic fluxes according to activity level and halide content of the fluxes.  Includes flux containing materials and low residue fluxes for no clean processes. 

IPC/EIA J-STD-005 Requirements for Soldering Pastes Covers requirements for qualification and characterization of solder paste.  Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder paste. 

IPC J-STD-006 Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications. Prescibes the nomenclature, requirements and test methods for electronic grade solder alloys, fluxed and non-fluxed bar, ribbon, and powder solder; electronic soldering applications and “special” electronic grade solders.This is a quality control standard and is not intended to relate directly to the materials performance in the manufacturing process.