This IPC 610 Certified IPC Specialist (CIS) training course will provide the students with the industry approved inspection criteria for all the assemblies commonly encountered in a electronic assembly environment.  This soldering training curriculum does not include hands on soldering, but does prepare the student to be able to evaluate solder joints, wiring harnesses, circuit board hardware, printed circuit board damage, jumper wires, circuit board modifications and much more.  

This training course has been updated to the D revision which brings some updated specification and a new modularized format.  With the modularized format, classes can be customized to cover the specific areas that your manufacturing facility uses.

The D revision has the added criteria for the lead free and BGA soldering inspection criteria, as well as updated information on bare board inspection criteria. Numerous lead free solder joint pictures have been added to quickly familiarize the student with new look of the lead free solder joint.

The IPC-A-610D, “Acceptability of Electronic Assemblies” is the most widely used specification published by the IPC for the electronics manufacturing industry.  There have been extensive and significant changes to the IPC A-610 with the launch of the D revision.  Many of the criteria have also changed, along with the addition of “lead-free’ solder criteria.  The IPC-A-610D Certified IPC Specialist (CIS) Course for initial certification now has 9 different Modules  

Module 1 – (required)
Introduction/IPC Professional Policies and Procedures

Module 2 – (required)
Foreward, Applicable Documents, & Handling

Module 3 – (optional)
Hardware Installation

Module 4 – (optional)
Soldering (Including High Voltage)

Module 5 – (optional)
Terminal Connections (Requires Module 4 prior to taking this module)

Module 6 – (optional)
Through Hole Technology (Including TH Jumper Wires) (Requires Modules 4 & 8 prior to taking this module)

Module 7 – (optional)
Surface Mount Assemblies (Including SMT Jumper Wires) ( Requires Modules 4 & 8 prior to taking this module)

Module 8 – (optional)
Component Damage and Printed Circuit Boards and Assemblies

Module 9 – (optional)
Solderless Wire Wrap

Successfully pass Modules 1 & 2 with an average score of 70% or better
Successfully pass Modules 3-9 with an average score of 70% or better
Upon successful completion student will receive an IPC “Application Specialist (CIS)” Operator Certificate